Package Engineering Service
- Pin assignment and PCB pre-layout
- QFP/QFN/BGA package service
- BGA substrate layout design
- KGD RDL layout design
- SiP/SOC bonding simulation
- Thermal simulation
System Design Service
- System EV boards
- Reference design
- Test boards support
- Load board design
- Test board (Socket board and AIP test board)
- EV boards
- HTOL/ELFR test board
- Electrical and reliability test
